Fa'aoga ile Semiconductor Alamanuia
GREEN ose National High-Tech Enterprise fa'apitoa mo le su'esu'ega ma le gaosiga o masini fa'aeletonika fa'aototometi ma fa'apipi'i semiconductor ma masini su'ega. Auauna atu i ta'ita'i pisinisi e pei ole BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, ma le 20+ isi Fortune Global 500 atina'e. Lau pa'aga fa'atuatuaina mo fofo faufale fa'apitoa.
O masini fa'apipi'i e mafai ai ona feso'ota'i fa'atasi ma le lautele o uaea, fa'amautinoa le fa'amaoni o fa'ailo; formic acid vacuum soldering fomu fa'alagolago so'oga i lalo o le okesene anotusi <10ppm, puipuia oxidation toilalo i le afifiina maualuga; AOI fa'alavelave fa'aletonu tulaga micron. O lenei fesoʻotaʻiga e faʻamautinoaina> 99.95% faʻapipiʻi faʻapipiʻi maualuga, faʻafeiloaʻi manaoga ogaoga o suʻega o 5G/AI meataalo.
Fa'amauina Uea Ultrasonic
Mafai ona fusifusia 100 μm–500 μm uaea alumini, 200 μm–500 μm uaea apamemea, lipine alumini e oo atu i le 2000 μm lautele ma le 300 μm mafiafia, faʻapea foʻi ma lipine apamemea.
Va'aiga femalagaiga: 300 mm × 300 mm, 300 mm × 800 mm (fa'atonuina), fa'atasi ai ma le toe fai <±3 μm
Va'aiga femalagaiga: 100 mm × 100 mm, fa'atasi ai ma le toe fai <±3 μm
O le a le Wire Bonding Technology?
O le fa'amauina o le uaea o se auala feso'ota'iga microelectronic e fa'aoga e fa'afeso'ota'i masini semiconductor i latou afifi po'o mea'ai. I le avea ai ma se tasi o tekinolosi sili ona taua i le semiconductor alamanuia, e mafai ai ona faʻafesoʻotaʻi vaʻa ma vaʻa fafo i masini eletise.
Mea Uaea Nonoa
1. Aluminium (Al)
E sili atu le eletise eletise vs. auro, taugofie
2. Kopa (Cu)
25% maualuga atu le eletise / vevela nai lo Au
3. Auro (Au)
Amioga sili ona lelei, tete'e o le pala, ma le fa'amaoni fa'amau
4. Siliva (Ag)
Fa'aoso maualuga i u'amea
Uaea Alumini
Lipine Alumini
Uaea Kopa
Lipine Kopa
Semiconductor Die Bonding & Wire Bonding AOI
Fa'aaogā se mea pu'eata fa'apisinisi e 25-megapixel e iloa ai fa'aletonu o lo'o pipi'i ma uaea i oloa e pei o ICs, IGBTs, MOSFETs, ma fa'ava'a ta'ita'i, e maua ai se fua faatatau e iloa ai se fa'aletonu e sili atu nai lo le 99.9%.
Mataupu o Asiasiga
Mafai ona su'esu'eina le maualuga ma le mafolafola o le pu, le fa'a'ese'ese o le pu, fa'asaga, ma le tipi; solder polo e le faʻapipiʻi ma solder solder detachment; fa'aletonu o feso'ota'iga uaea e aofia ai le maualuga po'o le le lava o le matasele, pa'u le matasele, uaea malepe, uaea misi, feso'ota'iga uaea, lolou uaea, kolosi matasele, ma le umi o le si'usi'u; le lava fa'apipi'i; ma le u'amea samasa.
Polo Solder/ Toega
Su'ega Chip
Tu'u Chip, Fua, Fua Fa'asaga
Fa'aleaga Chip/mea mai fafo
Tipi tipi
Ta'eta'e Alavai
Fa'a'ele'ele'ele'elea
AMB OXidation
I-Line Formic Acid Reflow Oga
1. Maualuluga maualuga ≥ 450°C， laʻititi tulaga gaogao <5 Pa
2. Lagolagoina le formic acid ma le nitrogen faagasologa siosiomaga
3. Tulaga tasi fua fua faatatau gaogao ≦ 1%, aofa'iga fa'aleaogaina fua faatatau ≦ 2%
4. Fa'alili vai + fa'amalieina o le nitrogen, fa'apipi'iina i se faiga fa'afefe vai ma fa'afeso'ota'i fa'amalulu
IGBT Power Semiconductor
O le tele o le fa'aleaogaina o fua i le IGBT fa'amauina e mafai ona fa'aosoina ai le fa'aletonu o feso'ota'iga e aofia ai le fa'amama fa'amama, ta'e fa'ainisinia, ma le fa'aleagaina o le eletise. O le fa'aitiitia o fua faatatau gaogao i le ≤1% e matua fa'aleleia atili ai le fa'atuatuaina o masini ma le malosi.
IGBT Fa'asologa o gaioiga o gaosiga
